5 Simple Techniques For Noohapou
5 Simple Techniques For Noohapou
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The POU3500 process delivers dynamic temperature Charge of the procedure chamber cathode / electrode / anode and can be synchronized with any etch method.
Resource & TCU application calibration strategies change exterior check devices not utilized on a regular basis for verifying
The information underneath is categorized by semiconductor course of action and Software company. Each and every desk incorporates an programs Matrix that exhibits qulified and industrial processes.
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This remarkable technique, supplying a small kind component, low Cost-of-possession and Dynamic Temperature Command supplied course of action and products engineers a new tool to improve their temperature delicate processes.
The precision in the POU 3300 permits independent Charge of the method fluid temperature to your wafer chuck within just +/- 0.1 °C of established level, as well as rapid response time with the process lets for optimum wafer-to-wafer repeatability through the etch procedure.
The precision of your POU 3500 allows for impartial Charge of the method fluid temperature to the wafer chuck within +/- 0.1 °C of established level, and the fast response time from the technique lets for optimum wafer-to-wafer repeatability all through the etch course of action.
Together with the POU3300, you'll be able to achieve unparalleled brings about etch effectiveness, chamber uptime, diminished expense of ownership and fab space utilization – all while improving upon your approach dependability.
The data pertains to your 300mm chamber temperature profile for the duration of a significant aspect ratio Etch approach, running at very higher RF electricity problems (~three.8kW). The compelling aspects of this info established are:
LAUDA-Noah is meeting these new difficulties and it read more has integrated Power conserving technological know-how in systems which have been pleasant for the environment and possess a affordable to function.
The TEs' can switch directly from heating to cooling, or visa-versa. They can switch on & off even though within the heating or cooling mode and can maximize or lower the amount of heating or cooling without having switching in any respect.
in excess of at any time, shrinking unit geometries, demanding new processes and a hugely competitive natural environment require temperature Command units that Merge speedy and correct temperature Command having an emphasis on decreased working prices and improved dependability.
the truth is always that genuine Dynamic Temperature Command can only be obtained when all five (five) of the subsequent system structure and set up specifications are met:
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We have to have a lot less cooling/heating ability for the same software for a static TCU because of our modest reservoir quantity.
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